SECO roadmap at electronica 2016 unveiled

electronica 2016

SECO is a world-leader in designing and manufacturing embedded systems. Spanning its 35+ years of experience, SECO has shown the ability to adapt its know-how to new, challenging customers needs, and to provide cutting edge solutions to its partners. SECO is proud to entirely produce in-house in Italy, from concept to manufacturing to product lifecycle, operating worldwide and with local offices in USA, India and Taiwan.

SECO offers complete modular solutions (SOMs) and Single Board Computers, using widely recognized standard off-the-shelf form factors (Qseven, COM Express, ETX). SECO products leverage leading semiconductor manufacturers with both x86 and ARM architectures (Intel, NXP, AMD, NVIDIA) and sets itself apart by providing custom design, development and system integration for general purpose applications or vertical markets, such as Medical, Visual Computing, IoT, etc.

Today, SECO is focused on developing innovative, high performance, cost-effective products based on the latest silicon manufacturers technologies, ensuring scalability and product longevity for wide temperature range applications.

Amongst the most important SECO solutions that will be showcased at electronica 2016 are:

  • the launch of the new Qseven Rel. 2.1 compliant module, based on the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 (formerly codenamed Apollo Lake) SoCs (Q7-B03);
  • the COM Express based on the Intel 6th generation Core/Xeon “Skylake-H” (COMe-B09-BT6);
  • and the high graphics performance COM Express with the AMD Embedded 3rd generation R-Series SOC (“Merlin Falcon”) or G-Series SOC-I (“Brown Falcon”) (COMe-A98-CT6).

The embedded system integration is another key highlight in the SECO’s roadmap: the new SYS-A62-10, for instance, is a 10.1” Panel PC based on the multicore NXP i.MX6 SoC family. Featuring a long-endurance display (30K hours) with 1280 (RGB) X 800 resolution, along with P-Cap (Projected-Capacitive touch) technology and glass cover, this system – available both with Linux and WEC7 – is an easy-to-integrate, flexible, open-source solution, particularly suitable for HMI, Industrial IoT, PoS and Vending applications.

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SECO also developed a new industrial IoT gateway solution: the SYS-A62-GW that is being presented at electronica 2016 as well. Based on a Single Board Computer with NXP i.MX6 processor, the SYS-A62-GW makes it easier to collect smart data from the real world through the cloud for a broad variety of IoT applications.

In addition to SECO’s industrial focus, the company has proven its commitment in launching products targeted for electronics enthusiasts, students, do-it-yourself makers, through the UDOO family of boards, counting on its partnership with major scientific universities and world-leading companies.

Almost three years after the launch of the first UDOO community board, an open hardware, low-cost computer equipped with an ARM i.MX6 NXP processor for Android and Linux, the UDOO family of products continue to generate interest in the DIY field. The UDOO Team’s latest creation is the UDOO X86, a powerful maker board that couples Intel’s new-generation Quad Core 64-bit x86 micro-processor with an onboard Intel Curie™Arduino™ 101-compatible micro-controller. UDOO X86, “the most powerful maker board ever”, will be showcased at SECO’s booth during the upcoming electronica 2016 exhibition as well.

Thanks to this newly acquired “Maker Movement” experience, SECO is creating a new embedded product line with a full range of industrial features that are enabling the maker world and DIY enthusiasts to bring their proof of concept to mass production.

SECO’s innovative and high performance solutions will be showcased at electronica 2016, both at the SECO booth (A6.438) and at the SGeT (Standardization Group for Embedded Technologies) booth (A6.549). The electronica 2016 is held in München, Germany, November 8-11, 2016.

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Anand Narayanaswamy is the editor-in-chief of Netans. He was recognized as a Microsoft Most Valuable Professional (MVP) for 9 years (2002 to 2011) and again as a Microsoft MVP in Surface under Windows and Devices in January 2024. He worked as a Chief Technical Editor with ASPAlliance and was part of ASPInsider program. Anand has published several articles and reviews related to various software and hardware products for various software and technology related websites. He is also active on social media and also participates as an Influencer for various brands. Anand can be reached at admin@netans.com

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