The Snapdragon 670 processor will hit the mobile markets early 2018. According to rumors emerging from Weibo via the user with the handle Grass grass grass, the Snapdragon 670 processor will be integrated with a 10nm manufacturing process with the next-generation Kyro cores. The processor will be running with 2 high power cores comprising of Kryo 360 and 6 low-power cores.
In all probability, the forthcoming Snapdragon processor will be released during the Q1 2018. Hence, you can expect the chipset to ship with new phones released after April 2018. The upcoming Snapdragon 670 processor will be most likely a third-generation core. If you compare the Snapdragon 835 and 660, it would be second generation cores.
The Snapdragon 670 will make use of ARM’s DynamIQ tech consisting of the Cortex A75 and A55 chipsets. Moreover, the graphics processor rumored to ship with SD 660 will be Adreno 6 series instead of Adreno 5 series. We expect the addition of Adreno 660 alongside Snapdragon 670 processor.
Hence, the new chipset will consume low power without sacrificing performance. The Snapdragon 670 will be optimum for gaming and other resource intensive tasks.
According to sources, the Snapdragon 670 will be manufactured based on Samsung 10nm LPP technology. It is a refresh of the 10nm LPE using in the currently available Snapdragon 835 and Exynos 8895 chips. The Snapdragon 670 processor will be integrated with Samsung, Xiaomi smartphones released after April 2018.
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